METHOD FOR BONDING SEMICONDUCTOR CHIT USING PHOTOSENSITIVE BONDING LAYER

摘要

PURPOSE: A method for bonding semiconductor chit using photosensitive bonding layer is provided to bond LOC type lead frames and a chip by forming photosensitive bonding layer having bonding force by radiating light, thereby reducing failure rate and enhancing productivity. CONSTITUTION: A method for bonding semiconductor chit using photosensitive bonding layer comprises; a first step disposing a photosensitive bonding layer having bonding force by radiating light on a front surface of a substrate and patterning it using a mask to form photosensitive bonding layer patterns; a second step individualizing unit chip on the substrate having the patterns formed by sawing process; and a third step attaching inner leads of a lead frame on the patterns.