发明名称 |
HEAT RADIATING APPARATUS OF BOARD |
摘要 |
PURPOSE: A heat radiating apparatus of a board is to efficiently radiate a heat generated from electronic components which are mounted on a board, thereby preventing a degradation of the board. CONSTITUTION: A heat radiating apparatus of a board comprises a prepreg(10) which is formed by a resin impregnated into fiber glass, coated copper foil is attached on both sides to form a board(70), a metal core(100) which is integrally impregnated into the resin-impregnated layer and a metal instrument as a heat sink which is connected with the metal core. The board is comprises of the resin-impregnated layer and a copper clad laminate(30) which is attached on both sides of the resin-impregnated layer and on which a copper foil(20) is attached. The metal core impregnated into the resin-impregnated layer of the copper clad laminate is made of Al. The metal instrument is mounted on the board to be protruded toward an outside of the board.
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申请公布号 |
KR20000041049(A) |
申请公布日期 |
2000.07.15 |
申请号 |
KR19980056818 |
申请日期 |
1998.12.21 |
申请人 |
SAMSUNG ELECTRO MECHANICS CO., LTD. |
发明人 |
KIM, HEUNG GYU;JEONG, JAE HEON |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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