发明名称 HEAT RADIATING APPARATUS OF BOARD
摘要 PURPOSE: A heat radiating apparatus of a board is to efficiently radiate a heat generated from electronic components which are mounted on a board, thereby preventing a degradation of the board. CONSTITUTION: A heat radiating apparatus of a board comprises a prepreg(10) which is formed by a resin impregnated into fiber glass, coated copper foil is attached on both sides to form a board(70), a metal core(100) which is integrally impregnated into the resin-impregnated layer and a metal instrument as a heat sink which is connected with the metal core. The board is comprises of the resin-impregnated layer and a copper clad laminate(30) which is attached on both sides of the resin-impregnated layer and on which a copper foil(20) is attached. The metal core impregnated into the resin-impregnated layer of the copper clad laminate is made of Al. The metal instrument is mounted on the board to be protruded toward an outside of the board.
申请公布号 KR20000041049(A) 申请公布日期 2000.07.15
申请号 KR19980056818 申请日期 1998.12.21
申请人 SAMSUNG ELECTRO MECHANICS CO., LTD. 发明人 KIM, HEUNG GYU;JEONG, JAE HEON
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址