| 摘要 |
PROBLEM TO BE SOLVED: To carry chip components in a component delivering passage to a component takeout position most suitably and at a high speed. SOLUTION: Chip component supply equipment 1 which lines up a large number of chip components A in bulk in one line and supplies them to an automated chip component mounting device 74, has a component reserving chamber 4 accommodating a large number of chip components in bulk, a component lining-up passage 10 provided below the component reserving chamber for lining up the chip components in one line and transferring them downward, a component delivering passage 12 provided in connection to the component lining-up passage so as to carry the chip components to a prescribed takeout position, and a vacuum suction mechanism 60 of which the openings 90 and 91 for suction are provided in the vicinity of the component takeout position of the component delivering passage and which, driven by the operation of the automated chip component mounting device to generate a force of vacuum suction, sucks the chip components in the component delivering passage from the openings for suction by this force of vacuum suction, and delivers them to the vicinity of the component takeout position. |
