| 摘要 |
PROBLEM TO BE SOLVED: To provide a filling material for dual damascene where bubbles do not occur, even if it is filled in a groove with large aspect ratio. SOLUTION: A trench hole is made by etching it in condition that the bottom of a via hole is filled with filling material, where a thermobridging compound is dissolved in an organic solvent. As the thermobridging compound, the substance where an amino group such as a melamine derivative, guanamine derivative, glycol uryl derivative, urea derivative, succinyl amide derivative, etc., or these replaced with a hydroxyalkyl group, an alkoxyalkyl group or both of them can be cited.
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