| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost and enhance the reliability of welding or soldering connection by forming a lead tip of a connector into a shape facilitating its welding, thereby enabling its direct welding connection to an electrode land of a substrate, or by simplifying the shape of a connection wire used in the connection of the connector to the substrate, thereby facilitating its welding or soldering connection to the lead tip part of the connector, in the case of a structure for connecting a substrate mounted with electronic components to a connector integrally molded with an enclosure case. SOLUTION: This connection structure is characterized in that a connection wire 4 is previously connected by wire bonding to an electrode land 3a of a substrate 3 together with electronic components, that a tip 4b of the connection wire 4 is formed into a raised shape for ease of welding, and that the raised tip 4b is connected to a lead tip 2a molded so as to project into the interior of an enclosure case 1 of a connector 2. |
