发明名称 EARTH TERMINAL
摘要 PROBLEM TO BE SOLVED: To easily confirm a solder attaching state, to miniaturize and to reduce cost by installing through burred holes or a base plate. SOLUTION: At least two burred through holes are installed in the length direction on a base plate 10 of an earth terminal. The inner circumferential part of the through hole 11 is cylindrically projected from the backside of the base plate 10 to the surface side by burring. A conducting pad of a printed circuit board is independently installed in the printed circuit board so as to corresponding to a plurality of through holes 11 installed in the base plate 10 of the earth terminal. When the base plate 10 is soldered to the pad of the printed circuit board, solder is attached along cylindrical projecting inner surface of the through hole 11, and solder is surely attached and connected in this part. Since a solder fillet is confirmed through the through hole 11, soldering defects can easily be checked.
申请公布号 JP2000195597(A) 申请公布日期 2000.07.14
申请号 JP19980369267 申请日期 1998.12.25
申请人 THOMAS & BETTS CORP <T&B> 发明人 KUMAGAI IZURU
分类号 H01R4/64;H01R4/48;H05K9/00;(IPC1-7):H01R12/32 主分类号 H01R4/64
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