| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate for a ball grid array package which can reduce thermal impact to a BGA package and prevent peeling of a pattern, etc., on a mounting substrate and a mounting method of a ball grid array package. SOLUTION: A through hole 13 passing through from a mounting surface 11 side whereto a BGA package is fixed to a rear 12 side is formed at a portion for soldering a solder bump in a mounting substrate 10 for mounting a BGA package 30, wherein an array of a solder bump 31 as a terminal is arranged. A solder bump 31 and the mounting substrate 10 are soldered by melting solder from a lower opening part 19 positioned at a rear side of opening parts 17, 19 at both ends of a through hole by a soldering bit 41 as a heating means 40.
|
