发明名称 METHOD AND DEVICE FOR MOUNTING PART
摘要 PROBLEM TO BE SOLVED: To allow a metal joint part at a specified height, when a part is mounted on a mounting object through a friction joint between metal joint parts under ultrasonic wave oscillation. SOLUTION: A part 3 is held with a part handling tool 14. A metal joint part 5 of the part 3 is faced to the metal joint part 5 of a mounting object 4 for pressurizing, while the part handling tool 14 is applied with an ultrasontc wave oscillation, so that the part 3 is mounted on the mounting object 4 through ultrasonic wave jointing with electric joint parts 5 and 6 under pressure for friction. Here, based on a position Hs, where the part handling tool 14 press- contacts the electric joint parts 5 and 6 together, an advancement amount H of the part handling tool 14 until the end of ultrasonic wave joint between the electric joint parts 5 and 6 is controlled, so that the heights of electric joint parts 5 and 6 after jointing are equal.
申请公布号 JP2000195907(A) 申请公布日期 2000.07.14
申请号 JP19980371618 申请日期 1998.12.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MINAMITANI SHOZO;AZUMA KAZUJI;KANAYAMA SHINJI;TAKAHASHI KENJI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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