| 摘要 |
PROBLEM TO BE SOLVED: To make the terminals of a semiconductor device difficult to deform before the mounting and make them relax its mounting stress after the mounting, by connecting with its respective electrodes arranged in an area-array form annular terminals for connecting with the electrodes of a mounting board its respective electrodes arranged in an area-array form. SOLUTION: A semiconductor element 1 is mounted on a circuit board 2 for connecting it electrically with the circuit board 2 by bonding wires 3. On the back surface of the circuit board 2 to its surface of mounting thereon the semiconductor element 1, electrodes 4 used for the connection with a mounting board whereon the semiconductor device is mounted are provided to connect them via solders 5 with terminals 6 formed into annular shape. Furthermore, for protecting the semiconductor element 1 and the connecting portions of the bonding wires 3 with the board 2, the semiconductor element mounting surface of the board 2 is coated with a sealing resin 7, etc. As the metal for forming the annular terminals 6, alloys can be utilized wherein one kind of gold, silver, lead, and so forth or two or more kinds of them are mixed with an alloy made of iron/nickel, and the foregoing alloys subjected to an suitable plating with satisfactory wettable solders can be also utilized.
|
