| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device and a method of manufacturing the same, which can realize thin and light-weight electronic device and also realize high reliability and performance. SOLUTION: A semiconductor device comprises a semiconductor chip 20 forming a first projected electrode 23 on a semiconductor substrate 21, a base substrate 31 and an intermediate substrate 30 consisting of a first external terminal 32 provided on the base substrate 31 and is jointed with the first projected electrode 23, a second external terminal 33 provided on the base substrate 31 and exposed at the electrode portions on both surfaces of the base substrate 31 and a second projected electrode 34 formed at one surface side of the second external terminal 33. A plurality of intermediate substrates 30 can be laminated by jointing the second projected electrode 34 and the other end surface side 31b of the second external terminal 33. |
