| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket of a BGA element having a contact block integrally formed with contacts arranged two-dimensionally so that uniform force is applied to a solder ball of the BGA element in a wiping action by forming a mount section so that the BGA element is stably mounted on the upper side of a contact block installation groove. SOLUTION: Oblong holes with slopes are arranged two-dimensionally so that uniform pressing force is applied to the surface of a solder ball when the oblong holes are brought into contact with the solder ball of a BGA element 1. Through grooves are formed at the centers of the oblong holes. A contact block 10 coated with a conductive material on the slopes of the oblong holes and the surfaces of the through grooves and a contact block installation groove for fitting the contact block 10 are formed. A housing 20 formed with mount sections 22, 23 is provided so that the BGA element 1 is stably fitted on the upper side of the contact piece block installation groove. The deformation or drop of the solder ball is prevented, and a CSP element manufactured on a wafer is electrically connected to a test device.
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