| 摘要 |
PURPOSE: An epoxy resin composition for sealing semiconductor devices is provided which improves adhesive characteristics between a lower surface of wafer chips and an epoxy encapsulating material in a package of a LOC structure. CONSTITUTION: An epoxy resin composition comprises an epoxy resin, a curing agent, an inorganic filler and other additives, wherein the epoxy resin is a diglycidylhexamethylbiphenyl epoxy resin and an epoxy resin pretreated by methoxy or ethoxy silane at its terminal group and contains a silicon modified epoxy product excepting the above component. The diglycidylhexamethylbiphenyl epoxy resin is obtained from 2,2',3,3',5,5' hexamethyl 4,4 biphenol of formula 1 and contained in the range of 1 to 6.0% by weight based on the total composition. The resin improves tilt actions by raising mechanical characteristics and fluidity. |
