| 摘要 |
PROBLEM TO BE SOLVED: To improve heat conductivity, flame resistance of a semiconductor sealing resin composition, by having it contain an epoxy resin, phenol resin, polyhedral composite metal hydroxide represented by a specific formula, and an inorganic powder having a specific thermal conductivity. SOLUTION: As an epoxy resin (A component), one of the various kinds of epoxy resins, e.g. a biphenyl-type epoxy resin, etc., is used by itself, or two or more kinds of them are used concurrently. A phenol resin (B component) acts as the hardening agent of the epoxy resin, and a phenol aralkyl resin is used preferably. With respect to a polyhedral metal hydroxide (C component), is used the one which is represented by the general formula m(MaOb).n(QdOe).cH2O [where M, Q are different metal elements from each other, and Q is a metal element selected from among groups IVa-VIIIa, Ib, IIb of the periodic table, and further m, n, a-e are integers.], and its crystalline outer shape preferable is substantially an octahedral structure to have an aspect ratio of about 1-8. An inorganic powder (D component) is a powder of an inorganic compound having a thermal conductivity not smaller than 4.0 W/m.K at ordinary temperature, and are exemplified by crystalline silica powder, alumina, and silicon carbide, etc. These components are contained in a semiconductor sealing resin composition.
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