| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of an IC socket by facilitating the work of installing, in a socket body, a seating plate for positioning an IC relative to a contact pin and facilitating the manufacture of a die for molding the seating plate. SOLUTION: In this IC socket, tip parts 40, 42 of portions engaging with a slit 28 in a seating plate 27, of a first contact part 32 and a second contact part 34 of a contact pin 17, are made thinner than the other parts of the contact pin 17, and therefore, when the seating plate 27 is mounted on a socket body 3, the thinned tip parts 40, 42 of the contact pin 17 smoothly engage with the slit 28. The tip parts 40, 42 guide the engagement of the contact pin 17 with the slit 28.
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