| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser module for improving reliability by preventing inconveniences in, which solder that has flowed out flows into an electronic cooler and the electronic cooler is short-circuited and hence does not function, when soldering a substrate where a semiconductor laser is mounted to the electronic cooler for welding. SOLUTION: An insulator 13C that is made of ceramics such as cylindrical forsterite for surrounding an electronic cooling element 13M is provided on an upper substrate 13U and a lower substrate 13D for pinching the electronic cooling element 13M, thus preventing surplus solder from flowing into the electronic cooling element, when soldering the lower substrate to a module package or soldering a substrate where the semiconductor laser is mounted to the upper substrate.
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