发明名称 HEAT RADIATIVE UNIT AND CIRCUIT UNIT EQUIPPED THEREWITH
摘要 PROBLEM TO BE SOLVED: To arranged heat radiative plate which elastically contact with an IC mounted on a printed wiring board without putting restriction on the pattern design of the printed wiring board. SOLUTION: This unit comprises a heat radiative plate 8 which is equipped with plural heat radiative fins 8A at specified intervals on one side, a rectangular frame 11, and a plate spring 10 which is equipped with at least two crosspieces 10A at the head being bent so that at least one end may be positioned under the mounting face to the frame. The plate spring 10 is connected integrally with the bottom of the frame 11, and further the crosspiece 10A of the plate spring 10 and the heat radiative fin 8A of the heat radiative plate 8 are integrally connected with each other.
申请公布号 JP2000196268(A) 申请公布日期 2000.07.14
申请号 JP19980368884 申请日期 1998.12.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HORI MASATOSHI;OGINO KIMINORI
分类号 H05K7/20;H05K7/12;(IPC1-7):H05K7/20 主分类号 H05K7/20
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