| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for manufacturing an electronic component connection body, wherein an electronic component connection body with high conduction reliability is manufactured, by applying a constant and sufficient pressure and heat to an electronic component having a large area. SOLUTION: A manufacturing device 1 comprises a thermocompression- bonding vessel 2, wherein the volume of a closed and pressurized space S1 is reduced when a piston 3 falls. A base stage 4 is provided with a heater 10, with a closing means 20 provided for closing the vicinity of the heater 10. A temporary connection body 30 is placed on the heater 10 and a heating space S2 is evacuated. After a compressed gas G is introduced into the pressurized space S1 of the thermocompression-bonding vessel 2, the piston 3 is made to fall so as to further compress the compressed gas G for thermocomporession- bonding of the temporary connection body 30.</p> |
