| 摘要 |
PROBLEM TO BE SOLVED: To simplify designing of a heat sink by thinning the heat sink and reducing its weight and further easily analyzing heat radiating characteristics of the heat sink. SOLUTION: A heat sink 1 is composed of a heat absorption part 11, a microheat pipe 12, and a cooling fin 14, and absorbs heat of electronic components by an areuate heat absorption part 11. Then, the microheat pipe 12 is in structure, where its heat is transferred to an annular cooling fin 14 in that an outer-periphery shape and an inner-peripheral shape are circular, and heat is radiated from the surface of the cooling fin 14. In this case, by allowing the microheat pipe 12 to project horizontally from the heat absorption part 11, the heat sink 1 is thinned and its weight is reduced. Furthermore, the designing of the heat sink can be simplified by providing a gap space 15 between the cooling fin 14 and the heat absorbing part 11.
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