| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an easy-to-destroy structure in the case of peeling off an IC tag stuck to an article. SOLUTION: In this IC tag structure for which an IC tag composed by providing a coil-like copper wire 8 to be an antenna and an IC chip, mounting the IC chip on a substrate 6, connecting it to the pattern part 9 of the substrate 6 and connecting the pattern part 9 of the substrate 6 and the connection ends 8a and 8b of the coil-like copper wire 8 further is clamped by two films 11 and 12 and adhered, one of the films is adhered to the entire surface of one of the side faces of the coil-like copper wire 8 and the other film is not adhered to the entire surface or a part of the other side face of the coil-like copper wire 8.</p> |
