发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE FILM
摘要 PROBLEM TO BE SOLVED: To improve reliability of connection to a fine pitch connection electrode formed with an oxide film by dispersing in an insulative adhesive agent conductive particles, having a protrusion on the surface of a conductive thin film formed on the surface of resin particles. SOLUTION: A protrusion 7, having a specified height on a conductive metal thin film 7, penetrates an oxide film 8 with the aid of repelling force of resin particles 71, when an anisotropic conductive adhesive film 1 is adhered to the surface of a glass pannel 4, then positioned and temporarily connected, and thermally press fitted at a prescribed temperature and pressure. Accordingly, an electrode 3 of a circuit board 2 and an electrode 5 of the glass pannel 4 are electrically connected to each other, and insulating adhesive resin 6 is hardened. The particle 71 has, preferably at 10% compression deformation, the hardness of value (k) of 1×102-2×103 kgf/mm2 and a recovery factor of 5% or more, and accordingly is effective. The metal thin film 72 formed by electroless plating gold or nickel has a compressive elasticity of 1.5×104 kgf/mm2 and 4-300 pieces. of surface protrusions on the average, and it is preferable that 1-15 volume % of conductive particles 7 be blended thereinto.
申请公布号 JP2000195339(A) 申请公布日期 2000.07.14
申请号 JP19980369068 申请日期 1998.12.25
申请人 SONY CHEM CORP 发明人 YAMADA YUKIO;SAKAIRI MIKIO;AKUTSU YASUSHI;ISHIMATSU TOMOYUKI
分类号 H01B5/16;C09J7/00;C09J9/02;G02F1/1345;H01B1/20;H01B1/22;H01B5/00;H01L21/60;H05K3/32;(IPC1-7):H01B5/16;G02F1/134 主分类号 H01B5/16
代理机构 代理人
主权项
地址