| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ceramic multilayer wiring board having a high substrate strength and a low dielectric loss by relieving generation of stress due to difference in thermal expansion or in firing shrinkage between an insulation substrate and an inner wiring circuit layer, in the multilayer wiring substrate formed by simultaneously firing with the insulation substrate comprising an aluminous ceramics containing high amount of alumina. SOLUTION: In a ceramic wiring board in which a wiring circuit layer 2b is arranged at least the inside of a ceramic insulating board 2 containing alumina of 98 weight % or more, the wiring board is constituted by a multilayer structure comprising a high void layer 2a containing a void of 0.2 to 5μm and in which the thickness of a single layer is 8 to 100μm, and a low void layer 2b whose voidage is lower than that of the high void layer by 10% or more, and the high void layer 2a is arranged on one of the surfaces of the inner wiring circuit layer 2b and the uppermost surface of the insulating board 2 is constituted by the low void layer 2a. |
