发明名称 SOLID-STATE IMAGE SENSING DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To realize a solid-state image sensing device which is enhanced in sensitivity to infrared rays and numerical aperture by a method wherein a charge storage part is formed inside a semiconductor layer, an inversion layer is formed on a part of the charge storage part, and a drain electrode is formed on the inversion layer to transfer the charge stored in the charge storage part. SOLUTION: A charge storage layer 14 which generates and stores the signal charge is formed in a region isolated by a P-type element isolation layer 12 on a P-type semiconductor substrate 10, and a P-type first inversion layer 15 is formed on the surface part of a part of the charge storage layer 14. An N-type drain electrode 31b of polysilicon is formed so as to be connected to the P-type first inversion layer 15 through the intermediary of a contact Cl. As mentioned above, the signal charge generated deep inside the substrate 10 is stored in the charge storage layer 14 without being swept away like in a vertical overflow drain, and the charge stored in the charge storage layer 14 is transferred.
申请公布号 JP2000196061(A) 申请公布日期 2000.07.14
申请号 JP19980371392 申请日期 1998.12.25
申请人 TEXAS INSTR JAPAN LTD 发明人 KARASAWA NOBUHIRO
分类号 H01L27/148;H04N5/335;H04N5/341;H04N5/353;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
代理机构 代理人
主权项
地址