| 摘要 |
PROBLEM TO BE SOLVED: To simplify the manufacture including the design by easily materializing a highly precise precoating. SOLUTION: This circuit module is one which is constituted such that a frame ground pattern 22, where a plurality of pads 222 being connected to a ground layer (not shown in the figure) and being electrically connected with one another through connecting patterns 223 are subdivided and are arranged apart, is provided corresponding to the electronic part mounting position of a printed wiring board, and that the plural pads 222 and the connecting patterns 223 are each precoated with solder by applying surface treatment of solder to the plural pads 222 and the connecting pattern 223 of the frame ground pattern 22 of this printed wiring board.
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