| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer/fixing jig, with which dicing, rear-surface grinding and die bonding steps in assembling steps of a semiconductor device can be carried out and which can easily peel off a thin chip, which was difficult in the bonding step in prior arts, and to provide a method for manufacturing the device. SOLUTION: This wafer transfer/fixing jig which has a thin plate 1 having the same diameter as a wafer 2 and formed therein with a plurality of holes 4 in the plate thickness direction and having an adhesive material 2 coated on one side of the thin plate is used, the rear surface of the wafer having grooves 6 deeper than the thickness of a completed chip in the main surface of a semiconductor element formed along a dicing line is ground and polished down to the thickness of the completed chip, the wafer is divided into individual chips, and the separated chips of the wafer are transferred to a die-bonding device. |
