| 摘要 |
PROBLEM TO BE SOLVED: To raise hybrid mounting property by providing a lead insertion part with a bump which enables soldering with a plane mounting part at once by a reflow method. SOLUTION: A solder bump 4 is provided in the middle of a lead 3 of a lead insertion part 1. When the part 1 is mounted on a circuit board 5 by inserting the lead 3 to a lead insertion hole 6 of the circuit board 5, the solder bump 4 is pressed to a mouth part of the lead insertion hole 6 and mounting state of the part 1 is stabilized. Then, the solder bump 4 is molten in a reflow furnace and molten solder is made to flow into the lead insertion hole 6, thus fixing the lead 3 to the circuit board 5.
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