| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a flip chip semiconductor device which can realize resin filling in a time shorter than that in prior arts and can reduce void defects caused by the involved air or a gas generated from resin. SOLUTION: In this method, a gap between a semiconductor element 11 and a circuit substrate 13 in a flip chip semiconductor device and outer peripheries thereof are filled with resin. Liquid resin 15 is coated on an outer periphery of a semiconductor element other than the part of the outer periphery having an exhaust hole 10 made therein, the element is placed in a vacuum chamber, the exhaust hole is forcibly closed by a squeegee immediately after the chamber is vacuumized, and then the chamber is forced to undergo vacuum break to fill the resin into the element by taking advantage of the atmospheric difference between the inside and the outside of the element. Since the exhaust hole is forcibly closed immediately after vaccumization, the resin filling of the flip chip semiconductor device can be realized in a time shorter than that in prior arts, and void defects due to the involved air or a gas generated from the resin can also be reduced. |
