| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip electronic component of side-mounting type and its manufacturing method, where the electronic component is surely enhanced in mounting strength and electrical connection reliability and self-aligned, when it is mounted on a motherboard. SOLUTION: A board 1 where an LED element 3 is assembled is sealed with a rectangular parallelopipedic molded epoxy resin 5. The LED element 3 is mounted on a board 1 to serve as a side light-emitting type element (the direction of light is shown by the arrow in figure), and the board 1 is so set in the resin molded body 5 as to face the front side of the molded body 5. Electrodes 6 provided on the surface of the molded body 5 are so arranged on the upper and lower edges of the molded body 5 for facedown bonding. The board electrodes and the molded body electrodes 6 are electrically connected together with electrodes that come out of the dicing face of the molded body 5 and a plating film formed on the dicing face. |
