| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce defect rate at assembly by making firm connection of a bonding pad to a bump electrode. SOLUTION: This electronic component includes a protective insulating film 3 covering a bonding pad 2, an opening 4 formed in the insulating film 3 making the pad 2 exposed, and a bump electrode 7 connected with the pad 2 within the opening 4. Open upper and lower areas of the opening 4 are set so that the upper region is smaller than the lower region. That is, an inner wall 4a of the opening 4 is tapered so as to be made gradually narrower from its lower side toward the upper side. By doing so, the bump electrode 7 is made hard to slip out through the opening 4, thereby attaining film connection between the pad 2 and electrode 7.</p> |
