| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which can be manufactured inexpensively, while satisfactorily maintaining positional accuracy of an optical semiconductor chip and has an improved optical characteristic. SOLUTION: An optical semiconductor device is provided with an optical semiconductor element 6, which is constituted by sealing an optical semiconductor chip 4 with a light-transmissive molding resin and has a flat joint surface 6a on the light-receiving surface side or light emitting surface side of the chip 4, a lens body 10 which has a positioning section 8 containing a flat bottom face 16a facing a joint surface 6a of the element 6 and is formed of a light- transmissive lens forming resin that is different from the molding resin correspondingly to the shape of the element 6, and a light-transmissive adhesive 9 which is interposed between the bottom face 16a of the positioning section 8 and the joint surface 6a of the element 6a in a state, where the chip 4 is aligned with an optical axis C of the lens body 10 and bonds the element 6 and lens body 10 to each other.
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