发明名称 |
METHOD AND APPARATUS FOR SEPARATING CHIP ON DICING SHEET |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus which can peel off a chip from a dicing sheet in satisfactory peeled conditions and can stably pick up the chip from the dicing sheet. SOLUTION: This apparatus includes a sheet-holding mechanism for holding a dicing sheet 21 having a chip 3 bonded thereto under tensioned condition, a suction stage 2 provided therein with a plurality of grooves 2a to be vacuum chucked corresponding in dimensions to the chip 3, and a vacuum chucking mechanism for vacuum chucking the sheet 21 onto the stage 2, when the chip 3 is separated from the sheet 21. The apparatus functions to separate the chip 3 from the sheet 21 so as to pick it up by vacuum chucking of the sheet 21 onto the stage 2.
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申请公布号 |
JP2000195877(A) |
申请公布日期 |
2000.07.14 |
申请号 |
JP19980371623 |
申请日期 |
1998.12.25 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MATSUMURA SHINYA;KIYOMURA HIROYUKI;TAKAHASHI KENJI;SHIDA SATOSHI;NASU HIROSHI;KANAYAMA SHINJI |
分类号 |
H01L21/52;(IPC1-7):H01L21/52 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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