发明名称 METHOD AND APPARATUS FOR SEPARATING CHIP ON DICING SHEET
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus which can peel off a chip from a dicing sheet in satisfactory peeled conditions and can stably pick up the chip from the dicing sheet. SOLUTION: This apparatus includes a sheet-holding mechanism for holding a dicing sheet 21 having a chip 3 bonded thereto under tensioned condition, a suction stage 2 provided therein with a plurality of grooves 2a to be vacuum chucked corresponding in dimensions to the chip 3, and a vacuum chucking mechanism for vacuum chucking the sheet 21 onto the stage 2, when the chip 3 is separated from the sheet 21. The apparatus functions to separate the chip 3 from the sheet 21 so as to pick it up by vacuum chucking of the sheet 21 onto the stage 2.
申请公布号 JP2000195877(A) 申请公布日期 2000.07.14
申请号 JP19980371623 申请日期 1998.12.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMURA SHINYA;KIYOMURA HIROYUKI;TAKAHASHI KENJI;SHIDA SATOSHI;NASU HIROSHI;KANAYAMA SHINJI
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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