| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sealingly molding resin for an electronic component which can realize simplification and miniaturization of a mold for sealing molding of the electronic component mounted on a lead frame and of a structure or entire shape of an automated mechanism, etc., provided in the vicinity thereof, simplification and accurate positioning between the electronic component and a mold cavity, and setting of identical molding conditions for such electronic components. SOLUTION: A short lead frame or a matrix lead frame 10 is supplied toward a resin molding mold, having upper and lower parts 1 and 2, an electronic component 12a as one of electronic components 12b mounted on the frame 10 is supplied sequentially to a mold cavity 5 and set therein, and then subjected to a resin-sealing molding process.
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