发明名称 SOLDERING METHOD AND SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a soldering method and soldering device for preventing soldering defect and soldering a flexible circuit board and an electric part stably and property. SOLUTION: Soldering is carried out by using far-infrared radiation as heat ray, forming an irradiation hole 21 large enough to irradiate an entire of an electric part 3 including at least a soldering part 4 by heat ray irradiation and irradiating an entire of the electric part 3 including the soldering part 4 with far-infrared radiation.
申请公布号 JP2000196232(A) 申请公布日期 2000.07.14
申请号 JP19980374648 申请日期 1998.12.28
申请人 OPTREX CORP;NIPPON SEIKI CO LTD 发明人 TAKAHIRA HIROSHI;IMAI MAKOTO;TAKAHASHI KENICHI
分类号 B23K1/00;B23K1/005;B23K1/008;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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