发明名称 |
SOLDERING METHOD AND SOLDERING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method and soldering device for preventing soldering defect and soldering a flexible circuit board and an electric part stably and property. SOLUTION: Soldering is carried out by using far-infrared radiation as heat ray, forming an irradiation hole 21 large enough to irradiate an entire of an electric part 3 including at least a soldering part 4 by heat ray irradiation and irradiating an entire of the electric part 3 including the soldering part 4 with far-infrared radiation. |
申请公布号 |
JP2000196232(A) |
申请公布日期 |
2000.07.14 |
申请号 |
JP19980374648 |
申请日期 |
1998.12.28 |
申请人 |
OPTREX CORP;NIPPON SEIKI CO LTD |
发明人 |
TAKAHIRA HIROSHI;IMAI MAKOTO;TAKAHASHI KENICHI |
分类号 |
B23K1/00;B23K1/005;B23K1/008;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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