| 摘要 |
Warping of a clamping ring, by which a series of semiconductor wafers (17) is held to a wafer holder (10) for vapor deposition of coatings onto the wafers (17), is retarded by providing a clamping ring (12) formed of the material having a coefficient of thermal expansion that is approximately the same as or close to that of the coating material being deposited onto the wafers (17). Preferably, the clamping ring (12) is one having a generally circular opening (24) that is slightly smaller than the wafers (17) to be clamped and that has a flat edge (29) on the inner edge (18) of the ring (12) corresponding to the orientation flat found on the outer edge of an industry standard wafer (17), so that the ring (12) engages the wafer during clamping around the entire outer rim of the wafer (17).
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