| 摘要 |
<p>A curable resin composition which comprises a modified copolymer obtained by incorporating an epoxidized unsaturated compound through addition into part of the acid groups of a copolymer obtained mainly from acrylic acid and a (meth)acrylic ester, and is excellent in resist film forming properties and ink sensitivity; a photocurable or thermosetting resin and a composition thereof which each comprises a modification of a specific copolymer having a Tg of 50°C or higher, and has satisfactory ink sensitivity and tack-free properties; a curable resin composition for resists which is obtained from a copolymer of β-carboxyethyl acrylate by epoxy-modifying the copolymer and either adding a functional acrylate monomer, e.g., acryloylmorpholine, to the copolymer after the epoxy modification or copolymerizing the functional monomer with the copolymer before the epoxy modification, is satisfactory in necessary properties, sensitivity, and resolution, and has improved plating resistance; and an alkali development type photocurable glass paste composition which comprises a curable resin, a photopolymerization initiator, a photopolymerizable monomer, a diluting solvent, and a glass frit and is capable of stably forming a highly fine and precise bulkhead pattern on the substrate of a large plasma display panel while keeping the working atmosphere, product yield, and production efficiency satisfactory.</p> |
