发明名称 RESIN MOLDED PRODUCT
摘要 <p>A resin molded product exhibiting a higher conductivity than that which can ordinarily be expected of the content of a conductive filler, especially a low surface resistance. This resin molded product contains a matrix of a resin material and a conductive filler dispersed in the matrix. The content of the conductive filler is set to less than 20 wt. %, and a voltage of 20 kV or higher and lower than a breakdown voltage of the matrix is applied. The conductive filler is made of fibers such as carbon fibers or graphite fibers having an average diameter of 0.002 to 15 microns, for example. This resin molded product usually contains a coloring agent dispersed in the matrix together with the conductive filler and presents a color according to that coloring agent.</p>
申请公布号 WO2000040642(P1) 申请公布日期 2000.07.13
申请号 JP1999006090 申请日期 1999.11.01
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