发明名称 |
Semiconductor wafer exposure device for photolithographic process in semiconductor component manufacture uses detection and analysis of light reflected from photoresist layer for controlling shutter in path of exposure beam |
摘要 |
The exposure device has a carrier (1) for positioning the semiconductor wafer (3) in 2 coordinate directions and a light beam device (5,19) for directing a light beam onto the semiconductor wafer via a mask (9), with detection of the light reflected from a photoresist layer of the semiconductor wafer via a light detector (13) coupled to an analyser (15) providing a control signal for an exposure control (17), used to operate a shutter (19) in the path of the exposure beam. An Independent claim for a semiconductor wafer exposure method is also included.
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申请公布号 |
DE19950987(A1) |
申请公布日期 |
2000.07.13 |
申请号 |
DE19991050987 |
申请日期 |
1999.10.22 |
申请人 |
SAMSUNG ELECTRONICS CO. LTD., SUWON |
发明人 |
SON, TAEK-SOO;PARK, TAE-SIN |
分类号 |
H01L21/027;G03F7/11;G03F7/20;(IPC1-7):G03F7/20 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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