发明名称 Semiconductor wafer exposure device for photolithographic process in semiconductor component manufacture uses detection and analysis of light reflected from photoresist layer for controlling shutter in path of exposure beam
摘要 The exposure device has a carrier (1) for positioning the semiconductor wafer (3) in 2 coordinate directions and a light beam device (5,19) for directing a light beam onto the semiconductor wafer via a mask (9), with detection of the light reflected from a photoresist layer of the semiconductor wafer via a light detector (13) coupled to an analyser (15) providing a control signal for an exposure control (17), used to operate a shutter (19) in the path of the exposure beam. An Independent claim for a semiconductor wafer exposure method is also included.
申请公布号 DE19950987(A1) 申请公布日期 2000.07.13
申请号 DE19991050987 申请日期 1999.10.22
申请人 SAMSUNG ELECTRONICS CO. LTD., SUWON 发明人 SON, TAEK-SOO;PARK, TAE-SIN
分类号 H01L21/027;G03F7/11;G03F7/20;(IPC1-7):G03F7/20 主分类号 H01L21/027
代理机构 代理人
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