| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of chip cracks at lead cutting, in order to prevent peeling of leads and resin at the interface, when a package is lifted. SOLUTION: A process for cutting the lead of package of which lead is exposed to the rear surface is included, and the lead is cut in this process under the condition that only a lead exposed part 1a of the rear surface of a package 1 is supported. Moreover, after cutting lead, only the lead exposed part 1a of the rear surface of package 1 is lifted for ejection during the process to eject the package. Thereby, even when a foreign matter such as resin is deposited to the center area of the rear surface of the package 1 at lead cutting, the stress is not concentrated to the area where the foreign matter is deposited, and thereby generation of package cracks and chip cracks which are serious faults can be prevented. Moreover, even if a situation arises in which the metal die cannot be separated easily from the package 1, a force which generates separation at the interface of the lead and resin is not be applied to the package 1.
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