| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate made of resin, where the gap between a substrate body and a socket or the like can be reduced when fitting the substrate made of resin for which number of pins are erected as an input/output terminal to the socket, other substrates, or the like. SOLUTION: A substrate 1 made of resin is provided with a substrate body 2, that is of plate shape with first and second main planes 2A and 2B and allows a number of recessed parts to be formed on the second main surface, and a number of pins 11 that are soldered to the metal layer on the bottom surface of the recessed part of the substrate body ?and allow a shaft part to project from the second main plane. Then, the creep-up height from the metal layer of the bottom surface of the recessed part of a solder material 15 that is welded to the large-diameter part and the shaft part of a pin is smaller than the height from the metal layer to the second main plane. Therefore, the shaft part of the pin can be inserted into deep portion of a socket SK, thus minimizing the gap between the second main plane of the substrate body and a first socket main surface SKA.
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