| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable to simplify an aligner, improving working efficiency of alignment, and secure an accuracy of alignment. SOLUTION: A height in Z-direction of an exposure face of a wafer 10 is measured with a light source 2 and a detector 3, focusing is conducted with an XYZ-stage 5 moved in a direction of Z, and each shot of the wafer 10 is exposed. A tilt of the exposure face of the wafer 10 is found with the light source 2 and the detector 3, and adjusted. That is to say, three shots on the wafer 10 arranged not in a straight line respectively measured for height to grasp the tilt of the exposure face, and a leveling stage 4 is driven, so that the exposure face is matched to the reference-lane by changing the tilt.</p> |
