| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket suitable to automatically mount an IC package thereon. SOLUTION: Contact pins 16 are provided on a bottom surface of a housing part 14, and two slide shutters 20 are provided capable of opening/closing in a double sliding manner in a direction normal to the mounting direction so as to cover the housing part and elastically biased by springs 22, respectively, in the closing directions. Opening-end edges of the slide shutters 20 are each given a chamfer 24 on the side of the housing part 14. The slide shutters 20 make opening motion due to a wedge effect by inserting a taper-shaped key 34 in the mounting direction, and the slide shutters 20 make closing motion due to the elasticity of the springs 22 by pulling out the key 34. The chamfers 24 abut on an IC package 12 following this closing motion, a resulting wedge effect depresses the IC package 12 in the mounting direction, and terminals of the IC package 12 are depressed against the contact pins 16, thus providing reliable electrical connection. |
