| 摘要 |
PROBLEM TO BE SOLVED: To provide a capillary-action intensified surface mount pin header capable of strengthening solder connection between pins and a printed circuit board. SOLUTION: One end part of each of a plurality of pins 30 extends through a corresponding plated through hole and the other end part thereof extends to the side surface of a first board 10. Each pin 30 is housed in at least a corresponding through hole 22 and has its outer surface at a portion delimiting a cross-section, The pins 30 each have a square or hexagonal cross-section and the plated through holes 22 each have a circular cross-section. The size of an elongate groove parallel to an axis is determined so as to facilitate a capillary action of molten solder at an opening part and to cause the solder to be sucked up through the groove in the direction of a confronting side surface of the first board 10. A second board 20 is disposed substantially in a position in a previously determined arrangement, and the solder before melting is disposed at a position near the groove in at least one plated through hole. |
