| 摘要 |
<p>Non-corrosive cleaning compositions that are useful for removing photoresist and plasma etch residues from a substrate. The cleaning composition comprises, by weight: (i) 30-70 % of a hydroxy-(lower alkyl)-hydrazine; (ii) 70-30 % of a water miscible organic solvent and (iii) 0-10 % water.</p> |
