| 摘要 |
PROBLEM TO BE SOLVED: To efficiently keep the temperature of a semiconductor device constant by a Peltier cooler even if the ambient temperature of a module varies, by a method wherein a lower part of a device wiring part is formed of material lower in thermal conductivity than other material that forms a lower part of a device fixing part, and both the materials have electrical insulating properties. SOLUTION: A sub-carrier 2 serves as a carrier where an optical semiconductor device such as a laser or an LED is mounted. The sub-carrier 2 is composed of a device fixing part 2a which is formed of insulating material of high thermal conductivity and mounted with an optical semiconductor device and a device wiring part 2b formed of insulating material of low thermal conductivity. Therefore, the device fixing part 2a is high in thermal conductivity, so that heat released from an EML chip is very efficiently conducted to a Peltier cooler. That is, an excellent thermal conduction path can be ensured between the EML chip and the Peltier cooler. On the other hand, the device wiring part 2b is low in thermal conductivity, so that heat is limitedly transmitted to or from the device wiring part 2b, and the thermal load of a Peltier cooler can be markedly lessened. |
