发明名称 |
ELECTRONIC MODULE CONTAINING COOLING ELEMENTS FOR ELECTRONIC COMPONENTS |
摘要 |
A data acquisition module (1) comprising a coupling board (15) with several electronic components (3, 8) that are mounted on at least one surface of said board. A protective cover (16) mounted opposite said surface covers the electronic components. In order to cool analog-to-digital converters of said module, a piston (41) that is connected to the protective cover (16) is pressed against the upper surface of at least one electronic component (3) in order to establish a thermal bridge between the electronic component and the protective cover. The piston is mounted on a support that is secured to the cover (16). The diameter of the portion (410) of the piston (41) that comes into contact with the electronic component (3) that is to be cooled is smaller than the diameter of the portion (411) of the piston that comes into contact with the support (40) for said piston.
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申请公布号 |
WO0041448(A1) |
申请公布日期 |
2000.07.13 |
申请号 |
WO1998CH00563 |
申请日期 |
1998.12.30 |
申请人 |
ACQIRIS SA;VITTET, JEAN-PIERRE;GOUMAZ JEAN-FRANCOIS |
发明人 |
VITTET, JEAN-PIERRE;GOUMAZ JEAN-FRANCOIS |
分类号 |
H05K7/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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