发明名称 Method and system for thermal coupling an electronic device to a heat exchange member
摘要 <p>The present invention relates to a temperature control system which maintains the temperature of an electronic device near a set point temperature and including: an electric heater (13) that has a first face (13a) for making contact with said electronic device (11), a second face (13b) which is opposite said first face (13a), a heat sink (14) which is coupled to said second face (13b) of said heater (13) such that said heater (13) is interposed between said heat sink (14) and said electronic device (11); and means for determining the temperature of the electronic device (11), preferably implemented as a temperature sensor (12c), further characterized by a control circuit (15), coupled to said means for determining the temperature of the electronic device and to said heater (13), which decreases the power to said heater (13) when the temperature of said electronic device (11) is above said set point, and vice-versa.</p>
申请公布号 EP0993243(A3) 申请公布日期 2000.07.12
申请号 EP19990124051 申请日期 1998.04.03
申请人 UNISYS CORPORATION 发明人 BABCOCK, JAMES WITTMAN;TUSTANIWSKYJ, JERRY IHOR
分类号 G01R31/26;G01R31/28;G05D23/19;H01L23/34;H01L23/373;H01L23/42;H05K7/20;(IPC1-7):H05K7/20;H01L21/66 主分类号 G01R31/26
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