| 发明名称 |
Methods and apparatus for the chemical mechanical planarization of electronic devices |
| 摘要 |
<p>Method and apparatus for chemically and mechanically planarizing the surface of a silicon wafer which includes a compressible non-cellualar lapping surface and a slurry disposed between the wafer and the lapping surface.</p> |
| 申请公布号 |
GB2329601(B) |
申请公布日期 |
2000.07.12 |
| 申请号 |
GB19980027129 |
申请日期 |
1997.06.06 |
| 申请人 |
* SPEEDFAM CORPORATION;* INTEGRATED PROCESS EQUIPMENT CORPORATION;* SPEEDFAM-IPEC CORPORATION |
发明人 |
CLINTON O * FRUITMAN |
| 分类号 |
B24B37/24;B24D13/14;C09K3/14;H01L21/304;H01L21/306;H01L21/3105;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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