发明名称 |
COOLING MODULE FOR ELECTRONIC COMPONENTS |
摘要 |
<p>An apparatus for removing heat from an electronic component. In one embodiment, a heat generating device is mounted to a top-side surface of a package substrate. A fluid flow channel that is defined at least partially by a portion of the back-side surface of the substrate is provided for passing a cooling medium. This configuration permits the cooling medium to be in direct contact with the back-side surface of the substrate, thus, reducing the overall thermal resistance between the heat generating device and cooling medium.</p> |
申请公布号 |
EP1018159(A1) |
申请公布日期 |
2000.07.12 |
申请号 |
EP19980939088 |
申请日期 |
1998.07.23 |
申请人 |
ADVANCED ENERGY&apos,S VOORHEES OPERATIONS |
发明人 |
MILLER, WILLIAM, J.;BHUTTA, IMRAN, A. |
分类号 |
H01L23/473;(IPC1-7):H01L23/473 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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