摘要 |
A number of contact terminals (20) is used, each of which has a number of protrusions (22) and recesses (23). The protrusions (22) are formed from smooth curved surfaces in the portion to contact the external connection terminals (50) of the electronic device. The recesses (23) are formed from smooth, curved surfaces adjacent to the respective protrusions (22). Independent claims are included for: (a) a method of forming a contact terminals of the socket (b) a method of testing an electronic device or a semiconductor package |