| 摘要 |
A ball grid array component test card, comprising a contact element block with a sloping face for uniform pressure application to a solder ball surface, is new. A test card comprises a contact element block which has a sloping face for uniform pressure application to the surface of a solder ball and which has a long hole with a central passage opening, the sloping face of the hole and the surface of the opening being coated with a conductive material. The test card also has a housing (20) with an opening for holding a contact element block, the upper section of the opening having a holding section (22, 23) for receiving a ball grid array component (1). An Independent claim is also included for a test card comprising a wafer housing, which has a wafer holding section and a contact element module opening, and a contact element module which is connected to the opening and which corresponds to a solder ball of a chip-sized package component on the wafer.
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