发明名称 Ceramic electronic part and mounting structure for the same
摘要 <p>In a mounting structure for a ceramic electronic part in which a terminal member formed of a metal plate is connected to a terminal formed on a ceramic electronic component, thermal effects caused by a substrate are to be suppressed to prevent mechanical damage to the ceramic electronic component, such as cracking. For this purpose, a length of an intermediate portion between the ceramic electronic component and the substrate, measured along the length of the terminal member, is at least 5 mm.</p>
申请公布号 GB2337876(B) 申请公布日期 2000.07.12
申请号 GB19990009600 申请日期 1999.04.26
申请人 * MURATA MANUFACTURING CO. LTD. 发明人 MASAYUKI * YAMADA;TAKUJI * NAKAGAWA
分类号 H01G2/06;H01G4/228;H05K1/18;H05K3/34;(IPC1-7):H01R4/58;H01G2/08 主分类号 H01G2/06
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